Hardening semiconductor components against radiation and temperature
William R Dawes, et al
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology
Catégories:
Année:
1989
Editeur::
Noyes Data Corp
Langue:
english
Pages:
342
ISBN 10:
0815512120
ISBN 13:
9780815512127
Fichier:
PDF, 15.46 MB
IPFS:
,
english, 1989